이 기사는 2022년 06월 03일 08:13 thebell 에 표출된 기사입니다.

Samsung Electronics vice chairman Lee Jae-yong met with Intel chief executive officer Patrick P. Gelsinger in Seoul to discuss possible cooperation in the semiconductor sector.

At the meeting, the leaders of the world's two largest chipmakers explored ways to collaborate in areas ranging from the next-generation memory chips, fabless system chips and foundries to PCs and mobile.

It is noteworthy that Kyung Kye-hyun, head of device solutions division at Samsung Electronics, Roh Tae-moon, head of mobile experience business, Lee Jung-bae, head of memory business, Choi Si-young, head of foundry and Park Yong-jin, head of LSI development also attended the meeting.

Intel and Samsung are both key players in the semiconductor industry. Intel has expertise in designing central processing unit (CPU) chips, while Samsung is a leader in manufacturing memory chips. Compatibility with CPUs is essential in developing next-generation memory chips.

Intel is expanding its business areas to cloud, network, data center, artificial intelligence (AI), robots, virtual reality (VR) and augmented reality (AR).

The U.S. tech giant is also focusing on the development of ultra-low latency content, which is expected to create synergy with Samsung’s fifth-generation mobile communication (5G) technology. Intel has been active in collaborating with Korean companies with 5G infrastructure, with the firm partnering with Naver Labs, the AI wing of South Korea's top web portal Naver, to develop 5G-based ultra-low latency service robots.

Some market insiders said Intel may produce its mainstay CPUs on its own while placing orders with Samsung to manufacture its other chipsets.

Samsung is known for being able to contract manufacture more advanced and thinner logic chips compared to Intel. The U.S. tech giant has long been working to break the 10-nanometer barrier, a goal that foundry competitors like Samsung and Taiwan-based TSMC claimed they have already achieved. (Reporting by Hye-ran Kim)